JPH0173971U - - Google Patents
Info
- Publication number
- JPH0173971U JPH0173971U JP1988152828U JP15282888U JPH0173971U JP H0173971 U JPH0173971 U JP H0173971U JP 1988152828 U JP1988152828 U JP 1988152828U JP 15282888 U JP15282888 U JP 15282888U JP H0173971 U JPH0173971 U JP H0173971U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- holes
- wiring layers
- approximately
- connect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988152828U JPH0173971U (en]) | 1988-11-24 | 1988-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988152828U JPH0173971U (en]) | 1988-11-24 | 1988-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173971U true JPH0173971U (en]) | 1989-05-18 |
Family
ID=31428109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988152828U Pending JPH0173971U (en]) | 1988-11-24 | 1988-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173971U (en]) |
-
1988
- 1988-11-24 JP JP1988152828U patent/JPH0173971U/ja active Pending
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